Synthesis and applications of low dielectric polyimide
With the advent of the 5 G era, advanced packaging applications such as wafer-level fan-out packaging have emerged thanks to efforts to reduce signal loss and increase signal transmission rates. As one of the key materials employed in telecommunication devices, the interlayer dielectric material dir...
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| Principais autores: | , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
KeAi Communications Co., Ltd.
2023-03-01
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| coleção: | Resources Chemicals and Materials |
| Assuntos: | |
| Acesso em linha: | http://www.sciencedirect.com/science/article/pii/S2772443322000411 |
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