Elucidating the Exceptional Passivation Effect of 0.8 nm Evaporated Aluminium on Transparent Copper Films

Slab-like copper films with a thickness of 9 nm (~70 atoms) and sheet resistance of ≤ 9 Ω sq−1 are shown to exhibit remarkable long-term stability toward air-oxidation when passivated with an 0. 8 nm aluminium layer deposited by simple thermal evaporation. The sheet resistance of 9 nm Cu films passi...

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Hlavní autoři:	Philip Bellchambers, Jaemin Lee, Silvia Varagnolo, Houari Amari, Marc Walker, Ross A. Hatton
Médium:	Artigo
Jazyk:	Inglês
Vydáno:	Frontiers Media S.A. 2018-12-01
Edice:	Frontiers in Materials
Témata:	copper passivation thin film lithography transparent electrode
On-line přístup:	https://www.frontiersin.org/article/10.3389/fmats.2018.00071/full
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