Thermal Performance Analysis of Various Heat Sinks Based on Alumina NePCM for Passive Cooling of Electronic Components: An Experimental Study

In the modern digital world, electronic devices are being widely employed for various applications where thermal performance represents a significant technical challenge due to continued miniaturization, high heat generated in the system, and non-uniform high-temperature causing failure. Phase chang...

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Egile Nagusiak:	Imran Zahid, Muhammad Farooq, Muhammad Farhan, Muhammad Usman, Adnan Qamar, Muhammad Imran, Mejdal A. Alqahtani, Saqib Anwar, Muhammad Sultan, Muhammad Yasar Javaid
Formatua:	Artigo
Hizkuntza:	Inglês
Argitaratua:	MDPI AG 2022-11-01
Saila:	Energies
Gaiak:	nano-enhanced phase change material simple heat sink square pin-fin heat sink copper foam heat flux thermal management
Sarrera elektronikoa:	https://www.mdpi.com/1996-1073/15/22/8416
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