Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

High-temperature-resistant polymeric adhesives with high servicing temperatures and high adhesion strengths are highly desired in aerospace, aviation, microelectronic and other high-tech areas. The currently used high-temperature resistant polymeric adhesives, such as polyamic acid (PAA), are usuall...

Ausführliche Beschreibung

Bibliografische Detailangaben

Hauptverfasser:	Hao-ran Qi, Deng-xiong Shen, Yan-jiang Jia, Yuan-cheng An, Hao Wu, Xin-ying Wei, Yan Zhang, Xin-xin Zhi, Jin-gang Liu
Format:	Artigo
Sprache:	Inglês
Veröffentlicht:	MDPI AG 2021-06-01
Schriftenreihe:	Nanomaterials
Schlagworte:	polyimide nano-fibrous membrane electrospinning adhesives lap shear strength
Online-Zugang:	https://www.mdpi.com/2079-4991/11/6/1525
Tags:	Tag hinzufügen Keine Tags, Fügen Sie das erste Tag hinzu!