Advances in microstructural evolution and reliability-driven mechanical and corrosion properties of lead-free SAC solder alloys

Lead-free solder alloys are essential for environmentally compliant electronic packaging, replacing traditional lead-based solders. Among them, tin–silver–copper (SAC) alloys have become the most widely adopted due to their excellent wetting behavior and relatively low melting temperatures compared...

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Autors principals:	Amirsalar Anousheh, Maryam Soleimani
Format:	Artigo
Idioma:	Inglês
Publicat:	Elsevier 2025-10-01
Col·lecció:	Materials & Design
Matèries:	SAC alloys Microstructural evolution Tensile properties Creep resistance Fatigue failure Corrosion behavior
Accés en línia:	http://www.sciencedirect.com/science/article/pii/S026412752500930X
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