Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry. Coupled with harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages. To reduce...
Na minha lista:
| Principais autores: | , , , , , , |
|---|---|
| 格式: | Artigo |
| 語言: | Inglês |
| 出版: |
MDPI AG
2020-03-01
|
| 叢編: | Journal of Manufacturing and Materials Processing |
| 主題: | |
| 在線閱讀: | https://www.mdpi.com/2504-4494/4/1/26 |
| 標簽: |
沒有標簽, 成為第一個標記此記錄!
|