Adaptive photonic and microfluidic chip packaging via 3D alignment structures

Combining photonic integrated circuits (PICs) with microfluidic devices offers new possibilities for optofluidic lab-on-a-chip applications. Their accurate assembly and packaging, particularly with precise alignment, remain challenging. This work presents a versatile optofluidic integration of photo...

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Bibliographic Details

Main Authors:	Rouven H. Klenk, Syeda Rameen, Christian Schweikert, Wolfgang Vogel, Markus Greul, Mathias Kaschel, Manfred Berroth, Georg Rademacher, Michael Heymann
Format:	Artigo
Language:	Inglês
Published:	Elsevier 2026-02-01
Series:	Sensing and Bio-Sensing Research
Subjects:	Optofluidics Photonics Grating coupler Microfluidics 3D-printing Sensing
Online Access:	http://www.sciencedirect.com/science/article/pii/S2214180425002107
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