Numerical Investigation of Nanofluid-filled Microchannel Heat Sinks for Improved Heat Transfer of High-power Electronic Devices
Effective thermal management is crucial for high-power electronic systems, as excessive heat can degrade performance and reduce device lifetime. This work examines the thermo-hydraulic performance of microchannel heat sinks filled with nanofluids (Ag₂O, Al₂O₃, CuO, and Fe₃O₄) under forced convection...
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| Principais autores: | , , |
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| 格式: | Artigo |
| 語言: | Inglês |
| 出版: |
Isfahan University of Technology
2026-04-01
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| 叢編: | Journal of Applied Fluid Mechanics |
| 主題: | |
| 在線閱讀: | https://www.jafmonline.net/article_2893_9719a00ed0c5709d80dfef33795dcef3.pdf |
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