Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate
The aim of this study was to characterize a Zn-Mg type soldering alloy and direct soldering of SiC ceramics with a copper substrate. The Zn1.5Mg solder exerts a wider melting interval. The temperature of the eutectic reaction was 365 °C, and the liquidus temperature was 405 °C. The microstructure of...
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| Autors principals: | , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
MDPI AG
2024-02-01
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| Col·lecció: | Applied Sciences |
| Matèries: | |
| Accés en línia: | https://www.mdpi.com/2076-3417/14/4/1504 |
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