Experiment on single diamond abrasive scratching 2D SiCf/SiC composite materials

To reveal the grinding removal mechanism of 2D SiCf/SiC composites, according to the weaving structure characteristics of 2D SiCf/SiC composites, scratching experiments were conducted on the woven surface (WS) and stacking surface (SS) of 2D SiCf/SiC along 0°, 45°, and 90° directions. The experiment...

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Autors principals:	Youzhe WANG, Yao LIU, Yang ZHOU, Jiahao LI, Hansen LI
Format:	Artigo
Idioma:	Chinês
Publicat:	Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd. 2024-06-01
Col·lecció:	Jin'gangshi yu moliao moju gongcheng
Matèries:	single diamond abrasive scratch sicf/sic composite material fiber orientations scratching force surface morphology
Accés en línia:	http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2023.0275
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