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Design for high performance, low power, and reliable 3D integrated circuits
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of...
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| Auteur principal: | |
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| Format: | Livro |
| Langue: | Inglês |
| Publié: |
Springer New York,
2013
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| Sujets: | |
| Accès en ligne: | https://minerva.ufrj.br/F/?func=direct&doc_number=000916785&local_base=UFR01 |
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