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Wafer level 3-D ICs process technology
Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for impro...
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| Main Authors: | , , |
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| Formato: | Livro |
| Idioma: | Inglês |
| Publicado em: |
Springer US,
2008
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| Colecção: | Integrated Circuits and Systems, |
| Assuntos: | |
| Acesso em linha: | https://minerva.ufrj.br/F/?func=direct&doc_number=000898245&local_base=UFR01 |
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