Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

по Yong, Yingqiong, Nguyen, Mai Thanh, Tsukamoto, Hiroki, Matsubara, Masaki, Liao, Ying-Chih, Yonezawa, Tetsu
Опубликовано в: Sci Rep (2017)