Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Por Yong, Yingqiong, Nguyen, Mai Thanh, Tsukamoto, Hiroki, Matsubara, Masaki, Liao, Ying-Chih, Yonezawa, Tetsu
Publicado no Sci Rep (2017)