Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

gan Zikulnig, Johanna, Roshanghias, Ali, Rauter, Lukas, Hirschl, Christina
Cyhoeddwyd yn Sensors (Basel) (2020)

Enthalpy Effect of Adding Cobalt to Liquid Sn-3.8Ag-0.7Cu Lead-Free Solder Alloy: Difference between Bulk and Nanosized Cobalt

gan Yakymovych, Andriy, Kaptay, George, Roshanghias, Ali, Flandorfer, Hans, Ipser, Herbert
Cyhoeddwyd yn J Phys Chem C Nanomater Interfaces (2016)

Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system

gan Roshanghias, Ali, Vrestal, Jan, Yakymovych, Andriy, Richter, Klaus W., Ipser, Herbert
Cyhoeddwyd yn CALPHAD (2015)

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

gan Roshanghias, Ali, Dreissigacker, Marc, Scherf, Christina, Bretthauer, Christian, Rauter, Lukas, Zikulnig, Johanna, Braun, Tanja, Becker, Karl-F., Rzepka, Sven, Schneider-Ramelow, Martin
Cyhoeddwyd yn Micromachines (Basel) (2020)