Evaluation of Contact Heat Transfer Coefficient and Phase Transformation during Hot Stamping of a Hat-Type Part

Por Kim, Heung-Kyu, Lee, Seong Hyeon, Choi, Hyunjoo
Publicado no Materials (Basel) (2015)

An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant

Por Song, Min-Jae, Kim, Kwon-Hee, Yoon, Gil-Sang, Park, Hyung-Pil, Kim, Heung-Kyu
Publicado no Materials (Basel) (2014)