APA引用形式

Xu, B., Hu, S., Hung, S., Shao, C., Chandra, H., Chen, F., . . . Shiomi, J. (2021). Weaker bonding can give larger thermal conductance at highly mismatched interfaces. Sci Adv.

シカゴスタイル引用形

Xu, Bin, Shiqian Hu, Shih-Wei Hung, Cheng Shao, Harsh Chandra, Fu-Rong Chen, Takashi Kodama, , Junichiro Shiomi. "Weaker Bonding Can Give Larger Thermal Conductance At Highly Mismatched Interfaces." Sci Adv 2021.

MLA引用形式

Xu, Bin, et al. "Weaker Bonding Can Give Larger Thermal Conductance At Highly Mismatched Interfaces." Sci Adv 2021.