Jin, Z., Shen, Y., Zuo, Y., Chan, Y. C., Mannan, S. H., & Nishikawa, H. (2021). Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods. Sci Rep.
Citação norma ChicagoJin, Zhi, Yu-An Shen, Yang Zuo, Y. C. Chan, S. H. Mannan, and Hiroshi Nishikawa. "Observation of Void Formation Patterns in SnAg Films Undergoing Electromigration and Simulation Using Random Walk Methods." Sci Rep 2021.
Citação norma MLAJin, Zhi, et al. "Observation of Void Formation Patterns in SnAg Films Undergoing Electromigration and Simulation Using Random Walk Methods." Sci Rep 2021.
Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.