Choi, G., Jang, K., Choi, K., Joo, J., Yun, H., Lee, C., & Eom, Y. (2021). Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining. Polymers (Basel).
Style de citation ChicagoChoi, Gwang-Mun, Ki-Seok Jang, Kwang-Seong Choi, Jiho Joo, Ho-Gyeong Yun, Chanmi Lee, et Yong-Sung Eom. "Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction With Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining." Polymers (Basel) 2021.
Style de citation MLAChoi, Gwang-Mun, et al. "Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction With Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining." Polymers (Basel) 2021.
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