Citazione APA

Nguyen, T., Chu, M., Tu, R., & Khine, M. (2021). The Effect of Encapsulation on Crack-Based Wrinkled Thin Film Soft Strain Sensors. Materials (Basel).

Stile di citazione Chicago

Nguyen, Thao, Michael Chu, Robin Tu, e Michelle Khine. "The Effect of Encapsulation On Crack-Based Wrinkled Thin Film Soft Strain Sensors." Materials (Basel) 2021.

Citazione MLA

Nguyen, Thao, Michael Chu, Robin Tu, e Michelle Khine. "The Effect of Encapsulation On Crack-Based Wrinkled Thin Film Soft Strain Sensors." Materials (Basel) 2021.

Attenzione: Queste citazioni potrebbero non essere precise al 100%.