APA استشهاد

Cheng, W., Hsieh, Y., & Liu, W. (2020). Enhanced Thermal Conductivity of Silicone Composites Filled with Few-Layered Hexagonal Boron Nitride. Polymers (Basel).

استشهاد بنمط شيكاغو

Cheng, Wei-Cheng, Yi-Ting Hsieh, و Wei-Ren Liu. "Enhanced Thermal Conductivity of Silicone Composites Filled With Few-Layered Hexagonal Boron Nitride." Polymers (Basel) 2020.

MLA استشهاد

Cheng, Wei-Cheng, Yi-Ting Hsieh, و Wei-Ren Liu. "Enhanced Thermal Conductivity of Silicone Composites Filled With Few-Layered Hexagonal Boron Nitride." Polymers (Basel) 2020.

تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.