APA način citiranja

Dai, X., Zhang, T., Shi, H., Zhang, Y., & Wang, T. (2020). Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics. ACS Omega.

Čikaški stil citiranja

Dai, Xiaofeng, Teng Zhang, Hongbin Shi, Yabing Zhang, i Tao Wang. "Reactive Sintering of Cu Nanoparticles At Ambient Conditions for Printed Electronics." ACS Omega 2020.

MLA način citiranja

Dai, Xiaofeng, et al. "Reactive Sintering of Cu Nanoparticles At Ambient Conditions for Printed Electronics." ACS Omega 2020.