Wu, H., Wang, Y., Li, Z., & Zhu, W. (2020). Investigations of the electrochemical performance and filling effects of additives on electroplating process of TSV. Sci Rep.
Citação norma ChicagoWu, Houya, Yan Wang, Zhiyi Li, and Wenhui Zhu. "Investigations of the Electrochemical Performance and Filling Effects of Additives On Electroplating Process of TSV." Sci Rep 2020.
MLA citiranjeWu, Houya, Yan Wang, Zhiyi Li, and Wenhui Zhu. "Investigations of the Electrochemical Performance and Filling Effects of Additives On Electroplating Process of TSV." Sci Rep 2020.
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