APA সাইটেশন

AGYAKWA, P., DAI, J., LI, J., MOUAWAD, B., YANG, L., CORFIELD, M., & JOHNSON, C. (2019). Three‐dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules. J Microsc.

শিকাগো স্টাইলে সাইটেশন

AGYAKWA, P., J. DAI, J. LI, B. MOUAWAD, L. YANG, M. CORFIELD, এবং C.M JOHNSON. "Three‐dimensional Damage Morphologies of Thermomechanically Deformed Sintered Nanosilver Die Attachments for Power Electronics Modules." J Microsc 2019.

এমএলএ সাইটেশন

AGYAKWA, P., et al. "Three‐dimensional Damage Morphologies of Thermomechanically Deformed Sintered Nanosilver Die Attachments for Power Electronics Modules." J Microsc 2019.