AGYAKWA, P., DAI, J., LI, J., MOUAWAD, B., YANG, L., CORFIELD, M., & JOHNSON, C. (2019). Three‐dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules. J Microsc.

AGYAKWA, P., J. DAI, J. LI, B. MOUAWAD, L. YANG, M. CORFIELD, و C.M JOHNSON. "Three‐dimensional Damage Morphologies of Thermomechanically Deformed Sintered Nanosilver Die Attachments for Power Electronics Modules." J Microsc 2019.

AGYAKWA, P., et al. "Three‐dimensional Damage Morphologies of Thermomechanically Deformed Sintered Nanosilver Die Attachments for Power Electronics Modules." J Microsc 2019.