Sayyadi, R., & Naffakh-Moosavy, H. (2019). The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints. Sci Rep.
استشهاد بنمط شيكاغوSayyadi, Reza, و Homam Naffakh-Moosavy. "The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints." Sci Rep 2019.
MLA استشهادSayyadi, Reza, و Homam Naffakh-Moosavy. "The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints." Sci Rep 2019.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.