Shen, Y., Lin, C., Li, J., He, S., & Nishikawa, H. (2019). Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder. Sci Rep.
シカゴスタイル引用形Shen, Yu-An, Chun-Ming Lin, Jiahui Li, Siliang He, , Hiroshi Nishikawa. "Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate On Sn Grain Size in Sn-3.0Ag-0.5Cu Solder." Sci Rep 2019.
MLA引用形式Shen, Yu-An, et al. "Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate On Sn Grain Size in Sn-3.0Ag-0.5Cu Solder." Sci Rep 2019.
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