Cita APA

Song, I., & Park, T. (2017). PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices. Micromachines (Basel).

Chicago Style Citation

Song, In-Hyouk, i Taehyun Park. "PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices." Micromachines (Basel) 2017.

Cita MLA

Song, In-Hyouk, i Taehyun Park. "PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices." Micromachines (Basel) 2017.

Atenció: Aquestes cites poden no estar 100% correctes.