APA引用形式

Wang, C., Luan, J., Tadepalli, S., Liu, K., Morrissey, J. J., Kharasch, E. D., . . . Singamaneni, S. (2016). Silk-Encapsulated Plasmonic Biochips with Enhanced Thermal Stability. ACS Appl Mater Interfaces.

シカゴスタイル引用形

Wang, Congzhou, Jingyi Luan, Sirimuvva Tadepalli, Keng-Ku Liu, Jeremiah J. Morrissey, Evan D. Kharasch, Rajesh R. Naik, , Srikanth Singamaneni. "Silk-Encapsulated Plasmonic Biochips With Enhanced Thermal Stability." ACS Appl Mater Interfaces 2016.

MLA引用形式

Wang, Congzhou, et al. "Silk-Encapsulated Plasmonic Biochips With Enhanced Thermal Stability." ACS Appl Mater Interfaces 2016.