Yang, B., Sharp, J. S., & Smith, M. I. (2016). The interplay of crack hopping, delamination and interface failure in drying nanoparticle films. Sci Rep.
Citación estilo ChicagoYang, Bin, James S. Sharp, and Mike I. Smith. "The Interplay of Crack Hopping, Delamination and Interface Failure in Drying Nanoparticle Films." Sci Rep 2016.
Cita MLAYang, Bin, James S. Sharp, and Mike I. Smith. "The Interplay of Crack Hopping, Delamination and Interface Failure in Drying Nanoparticle Films." Sci Rep 2016.
Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.