Amna, T., Yang, J., Ryu, K., & Hwang, I. H. (2014). Electrospun antimicrobial hybrid mats: Innovative packaging material for meat and meat-products. J Food Sci Technol.
Chicago-tyylinen lähdeviittausAmna, Touseef, Jieun Yang, Kyeong-Seon Ryu, ja I. H. Hwang. "Electrospun Antimicrobial Hybrid Mats: Innovative Packaging Material for Meat and Meat-products." J Food Sci Technol 2014.
MLA-viiteAmna, Touseef, Jieun Yang, Kyeong-Seon Ryu, ja I. H. Hwang. "Electrospun Antimicrobial Hybrid Mats: Innovative Packaging Material for Meat and Meat-products." J Food Sci Technol 2014.
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