Chong Leong, G., & Uda, H. (2013). Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging. Public Library of Science.
Citação norma ChicagoChong Leong, Gan, and Hashim Uda. Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging. Public Library of Science, 2013.
MLA citiranjeChong Leong, Gan, and Hashim Uda. Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging. Public Library of Science, 2013.
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