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Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface
Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational spe...
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| Autores principales: | , , , |
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| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
MDPI AG
2014-11-01
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| Colección: | Materials |
| Materias: | |
| Acceso en línea: | http://www.mdpi.com/1996-1944/7/11/7366 |
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