Microstructure Evolution in Cu-Ni-Co-Si-Cr Alloy During Hot Compression by Ce Addition

Cu-Ni-Si alloys are widely used in lead frames and vacuum devices due to their high electrical conductivity and strength. In this paper, a Cu-Ni-Co-Si-Cr-(Ce) alloy was prepared by vacuum induction melting. Hot compression tests of the Cu-Ni-Co-Si-Cr and Cu-Ni-Co-Si-Cr-Ce alloys were carried out usi...

Täydet tiedot

Tallennettuna:
Bibliografiset tiedot
Päätekijät: YiJie Ban, Yi Zhang, Baohong Tian, Yanlin Jia, Kexing Song, Xu Li, Meng Zhou, Yong Liu, Alex. A. Volinsky
Aineistotyyppi: Artigo
Kieli:Inglês
Julkaistu: MDPI AG 2020-07-01
Sarja:Materials
Aiheet:
Cu-Ni-Co-Si-Cr-(Ce) alloys
hot deformation
microstructure evolution
electron backscattered diffraction (EBSD)
processing map
Linkit:https://www.mdpi.com/1996-1944/13/14/3186
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