Study on the High Temperature Interfacial Stability of Ti/Mo/Yb0.3Co4Sb12 Thermoelectric Joints

To improve the interfacial stability at high temperatures, n-type skutterudite (SKD) thermoelectric joints with sandwich structures of Ti/Mo/Yb0.3Co4Sb12 were successfully designed and fabricated. In this structure, Mo and Ti were introduced as the barrier layer with the goal of suppressing the inte...

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Bibliografski detalji
Glavni autori: Ming Gu, Shengqiang Bai, Xugui Xia, Xiangyang Huang, Xiaoya Li, Xun Shi, Lidong Chen
Format: Artigo
Jezik:Inglês
Izdano: MDPI AG 2017-09-01
Serija:Applied Sciences
Teme:
thermoelectric joint
skutterudite
diffusion kinetics
contact resistivity
service life prediction
Online pristup:https://www.mdpi.com/2076-3417/7/9/952
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