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The microstructure and mechanical properties of copper in electrically assisted tension

This study focuses on the mechanical behavior and microstructure evolution of oxygen-free high conductivity copper in the presence of electropulse. The result shows the tensile strength and strain-to-failure decrease linearly with the increase of pulse frequency, and the fracture mode changes from d...

Täydet tiedot

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Bibliografiset tiedot
Päätekijät: Jing He, Zhi Zeng, Huabing Li, Shuai Wang
Aineistotyyppi: Artigo
Kieli:Inglês
Julkaistu: Elsevier 2020-11-01
Sarja:Materials & Design
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Linkit:http://www.sciencedirect.com/science/article/pii/S0264127520307061
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