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The microstructure and mechanical properties of copper in electrically assisted tension
This study focuses on the mechanical behavior and microstructure evolution of oxygen-free high conductivity copper in the presence of electropulse. The result shows the tensile strength and strain-to-failure decrease linearly with the increase of pulse frequency, and the fracture mode changes from d...
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| Hauptverfasser: | , , , |
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| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
Elsevier
2020-11-01
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| Schriftenreihe: | Materials & Design |
| Schlagworte: | |
| Online Zugang: | http://www.sciencedirect.com/science/article/pii/S0264127520307061 |
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