The microstructure and mechanical properties of copper in electrically assisted tension

This study focuses on the mechanical behavior and microstructure evolution of oxygen-free high conductivity copper in the presence of electropulse. The result shows the tensile strength and strain-to-failure decrease linearly with the increase of pulse frequency, and the fracture mode changes from d...

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Hlavní autoři: Jing He, Zhi Zeng, Huabing Li, Shuai Wang
Médium: Artigo
Jazyk:Inglês
Vydáno: Elsevier 2020-11-01
Edice:Materials & Design
Témata:
Electropulsing treatment
Tensile test
Copper
Fracture mode transition
Electrically assisted forming
On-line přístup:http://www.sciencedirect.com/science/article/pii/S0264127520307061
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