Chargement en cours...
Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure
A difference in interfacial structure derived from a difference in binding mechanisms, was assessed to obtain a robust Cu/In interface with low-temperature fluxless solder bonding. As examples of typical bonding methods, Ar fast atom beam (Ar-FAB) surface activation in high vacuum and vapor-assisted...
Enregistré dans:
| Auteurs principaux: | , , |
|---|---|
| Format: | Artigo |
| Langue: | Inglês |
| Publié: |
Elsevier
2020-10-01
|
| Collection: | Materials & Design |
| Sujets: | |
| Accès en ligne: | http://www.sciencedirect.com/science/article/pii/S0264127520306006 |
| Tags: |
Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!
|