Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure

A difference in interfacial structure derived from a difference in binding mechanisms, was assessed to obtain a robust Cu/In interface with low-temperature fluxless solder bonding. As examples of typical bonding methods, Ar fast atom beam (Ar-FAB) surface activation in high vacuum and vapor-assisted...

Full description

Saved in:
Bibliographic Details
Main Authors: Y.S. Chiu, C.R. Kao, A. Shigetou
Format: Artigo
Language:Inglês
Published: Elsevier 2020-10-01
Series:Materials & Design
Subjects:
Bonding
Low temperature solder
Surface analysis
3D packaging
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127520306006
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items