Determination on the thermal conductivity and thermal contact resistance of thin composite phase change films as a thermal interfacial material

Sub-millimeter thick phase change material (PCM) composites have been utilized in the thermal management of micro-electronics serving as a novel thermal interfacial material. However, there is a lack of appropriate measuring methods and precise data for the thin-film PCM composites' intrinsic t...

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Bibliografiset tiedot
Päätekijät: Biao Feng, Yu-Hong Zhang, Jing Tu, Li-Wu Fan, Zi-Tao Yu
Aineistotyyppi: Artigo
Kieli:Inglês
Julkaistu: Elsevier 2022-05-01
Sarja:Case Studies in Thermal Engineering
Aiheet:
Corrected transient plane source technique
Steady-state heat flow method
Thin-film phase change material
Thermal conductivity
Thermal contact resistance
Thermal interfacial material
Linkit:http://www.sciencedirect.com/science/article/pii/S2214157X22002258
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