Determination on the thermal conductivity and thermal contact resistance of thin composite phase change films as a thermal interfacial material

Sub-millimeter thick phase change material (PCM) composites have been utilized in the thermal management of micro-electronics serving as a novel thermal interfacial material. However, there is a lack of appropriate measuring methods and precise data for the thin-film PCM composites' intrinsic t...

Deskribapen osoa

Gorde:
Xehetasun bibliografikoak
Egile Nagusiak: Biao Feng, Yu-Hong Zhang, Jing Tu, Li-Wu Fan, Zi-Tao Yu
Formatua: Artigo
Hizkuntza:Inglês
Argitaratua: Elsevier 2022-05-01
Saila:Case Studies in Thermal Engineering
Gaiak:
Corrected transient plane source technique
Steady-state heat flow method
Thin-film phase change material
Thermal conductivity
Thermal contact resistance
Thermal interfacial material
Sarrera elektronikoa:http://www.sciencedirect.com/science/article/pii/S2214157X22002258
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