Yamamoto, M., Matsumae, T., Kurashima, Y., Takagi, H., Suga, T., Takamatsu, S., . . . Higurashi, E. (2020). Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding. MDPI AG.

Yamamoto, Michitaka, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Seiichi Takamatsu, Toshihiro Itoh, and Eiji Higurashi. Effect of Au Film Thickness and Surface Roughness On Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing By Au-Au Surface Activated Bonding. MDPI AG, 2020.

Yamamoto, Michitaka, et al. Effect of Au Film Thickness and Surface Roughness On Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing By Au-Au Surface Activated Bonding. MDPI AG, 2020.