Результаты поиска - Zejun Zeng

Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures по Xinyue Wang, Haixue Chen, Zhoudong Yang, Wenting Liu, Zejun Zeng, Guoqi Zhang, Jing Zhang, Jiajie Fan, Pan Liu

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