EQUIPMENT FOR NONDESTRUCTIVE TESTING OF SILICON WAFERS SUBMICRON TOPOLOGY DURING THE FABRICATION OF INTEGRATED CIRCUITS

di S. A. Chizhik, S. P. Basalaev, V. A. Pilipenko, A. L. Khudoley, T. A. Kuznetsova, V. V. Chikunov, A. A. Suslov
Pubblicazione 2015-03-01